A 30% footprint reduction without sacrificing throughput makes the Micro VCCL is a must-see Las Vegas attraction
When it comes to packaging high volumes of paper cups with limited floor space – Rennco has the answer!
Rennco, a ProMach brand, is debuting the new Micro VCCL (Vertical Cup Counter Loader), a solution that reduces footprint by 30% without sacrificing throughput, in booth C-3633 at PACK EXPO 2023, September 11-13, at the Las Vegas Convention Center, Las Vegas, Nevada.
Rennco specializes in flexible, end-of-line packaging by providing vertical semi-automatic and automatic bagging solutions utilizing center-folded packaging material.
The inception of the Micro VCCL is rooted in feedback from customers operating with limited floorspace but needing the same throughput and labor savings as achieved on Rennco’s traditional VCCL packaging systems. The solution is the Micro VCCL, a technologically advanced system that reduces footprint by 30% without sacrificing speed or reliability.
At the heart of the Micro VCCL is a proprietary shuttle tower infeed that eliminates the need for the traditional staging area and belt infeed. This is where the reduction in footprint is achieved. The dual-lane tower design is capable of handling 330 cups per minute per lane. The machine also maintains cup reject and manual reload functionality for quality control.
The Micro VCCL was designed in 2021 and then spent a year in beta testing with select customers with promising results. In head-to-head comparisons with larger, competitive machinery, the Micro VCCL held its own, delivering the same performance, speed, and control Rennco customers have come to expect.
The machine can be integrated with upstream and downstream automation through its powerful Allen Bradley processor; customers have the option to attach a common case packer to the discharge area to increase returns in efficiency. Finally, the Micro VCCL can be configured and released to purchasing and manufacturing within hours of receiving a purchase order, a true example of Rennco’s commitment to reducing lead time through standardization.
Add booth C-3633 to your PACK EXPO 2023 itinerary to see live demonstrations of the new Micro VCCL.
